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We warmly welcome collaborations with both academic and industrial partners in any form.

歡迎學術界以及業界夥伴提出合作專案

Please email to: yushengsu at nycu.edu.tw

請來信及提供聯絡方式

Analysis Tool
Function
Tool Photo
感應耦合電漿質譜 (Inductively coupled plasma mass spectrometry)
ICP-MS analysis
臨場多功能X光繞射儀 (In-situ multi-functional X-ray diffractometer)
In-situ XRD analysis
熱微差掃描分析儀 (Differential scanning calorimetry)
DSC thermal analysis
高解析液相層析串聯質譜儀 (High Resolution Liquid Chromatography Tandem Mass Spectrometer)
UPLC/HRMS/MS analysis
X光光電子暨歐傑電子能譜儀 (X-ray Photoelectron and Auger Electron Spectroscopy)
XPS/AES analysis
高解析氣相層析質譜儀 (High Resolution Gas Chromatograph Mass Spectrometer)
High-resolution Mass
高解析核磁共振光譜儀 (NMR 500)
High-resolution NMR
高效能可變溫多功能X光繞射儀 (High performance low temperature and multi-function X-ray diffractometer)
Low-temperature XRD
多功能光譜量測系統 (Spectrum Measurement System)
Photoluminescence (PL) /Electricluminescence (EL)/Time-resolved PL (TCSPC)
高解析共焦拉曼顯微鏡光譜儀 (High Resolution Confocal Raman Microscope)
Raman spectrum analysis
X光繞射儀系統 (X-ray Diffraction System)
XRD diffraction analysis
低溫電性量測平台 (Cryogenic Probe Station)
Low-temperature electrical property analysis
高解析度X光繞射儀 (High Resolution X-ray Diffractometer)
XRD diffraction analysis
紫外/可見/紅外光分光光譜儀(Variable-angle UV/VIS/NIR Spectrophotometer)
UV/VIS/NIR spectrum analysis
掃瞄式電子顯微鏡/能量色散光譜儀 (Scanning Electron Microscope/Energy Dispersive X-ray Spectrometer)
SEM and EDS analysis
離子剪薄機 (Precision Ion Polishing System)
TEM sample preparation
低溫高分辨穿透式電子顯微鏡 (Cryo High Resolution Transmission Electron Microscope)
Cryo TEM imaging
場發射穿透式電子顯微鏡 (Field Emission Gun Transmission Electron Microscope)
TEM imaging
傅氏紅外線光譜儀 (Fourier Transform Infrared Spectrometer FTIR)
FTIR spectrum analysis
原子力顯微鏡 (Atomic Force Microscope Edge)
Tapping Mode AFM
原子力顯微鏡 (Atomic Force Microscope D3100)
Tapping Mode AFM
橢圓測試儀 (Ellipsometer)
Film dielectric property measurements
四點探針 (4-point Probe)
Film resistance measurements
探針式輪廓儀 (Dektak XT)
Film height difference measurements
全光譜反射式膜厚量測儀 (Reflectometer)
Thickness measurements for SiO2、Si3N4、Poly-Si、TEOS films
高解析度場發射掃描電子顯微鏡暨能量散佈分析儀 (High-Resolution Cold Field Emission Scanning Electron Microscope & Energy Dispersive Spectrometer, SEM, EDS)
SEM analysis
冷場發射掃描式電子顯微鏡暨能量散佈分析儀器 (Cold Field Emission Scanning Electron Microscope (Hitachi SU8010) & Energy Dispersive Spectrometer)
SEM and EDS analysis
聚焦離子束與電子束顯微系統 (Dual beam [focused ion beam & electron beam] System) FIB
Cross-section microstructure imaging
Semiconductor Tool
Function
Tool Photo
真空濺鍍系統 B (Sputtering System B)
Multilayer sputtering
真空濺鍍系統 A (Sputtering System A)
Multilayer sputtering
高真空鍍膜系統 (High Vacuum Deposition System)
Multilayer sputtering
電子槍蒸鍍系統 (E-Beam Evaporator System)
Ti, Cr, Al, Au deposition
雙電子槍蒸鍍系統 B (Dual E-Gun Evaporation System B)
Multilayer deposition
雙電子槍蒸鍍系統 A (Dual E-Gun Evaporation System A)
Multilayer deposition
熱阻絲蒸鍍系統 (Thermal Evaporation Coater)
Al deposition
介電質蝕刻系統 (Dielectric Materials Reactive Ion Etching System)
SiO2, Si3N4, SiC dry etching
介電材料活性離子蝕刻系統 B (Dielectric Materials Reactive Ion Etching System
SiO2, Si3N4 etching
介電材料活性離子蝕刻系統 A (Dielectric Materials Reactive Ion Etching System)
SiC etching
多腔體電漿蝕刻系統 (Multi-Chamber Plasma Etching System, P5000E)
SiO2, Si3N4, Poly-Si etching
複晶矽活性離子蝕刻系統 (Poly-Si Reactive Ion Etching System, Poly-Si RIE)
Si/Poly-Si etching
高密度活性離子蝕刻系統 (High Density Plasma Reactive Ion Etching System, HDP-RIE)
Al dry etching
矽深蝕刻系統 (Si Deep-RIE)
Bosch Process for Si dry etching
原子層化學氣相沉積系統(Atomic Layer Chemical Vapor Deposition System, ALD)
Al2O3, HfO2, TiN, ZrO2, TiO2 deposition
電漿輔助化學氣相沉積系統 (Plasma-Enhanced Chemical Vapor Deposition, PECVD)
SiO2, Si3N4 deposition
氧化擴散系統 (Oxidation & Diffusion Furnaces)
Max Temp:1100°C; heating zone: 900mm; tube diameter: 6″
低壓化學氣相沉積系統 (Low Pressure Chemical Vapor Deposition, LPCVD)
Poly-Si in-situ PH3; poly-Si & amorphous-Si; SiGe; Si3N4; TEOS
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